Analysis of Hair Removal Laser Module Product Technical Advantages

Analysis of Hair Removal Laser Module Product Technical Advantages

Material Selection

We use military-grade CuW and specially formulated AuSn solder, along with imported laser chips, to ensure the fundamental reliability of the packaging.

Excellent electrical performance of chip

1. Low resistance

The lower the resistance of the chip during operation, the less heat it generates. Working at high temperatures is more stable and the lifespan of the device is longer.

2. Thermal stability

Heat can affect the continued operation of semiconductors. One approach is to use active cooling to handle the heat. If the heat is not dealt with promptly, it will cause thermal accumulation in the area where the laser chip generates heat, accelerating the disintegration of the chip material due to high temperature. Generally, the feedback indicates that the power of the chip decays too quickly and the chip burns out. Therefore, the ability of the chip material to withstand high temperatures is a very important indicator. We often call it the "electrothermal stability" of the chip, and the highest junction temperature X is used as the constant parameter for the characterization.

3. Thermal Management

Guided by thermal simulation software and validated through extensive experimental data, we have developed an optimized thermal dissipation model that enables high power density laser chips to be packaged within a compact footprint.

4. Optical Shaping

Customized beam shaping is available to meet client requirements, offering excellent energy transmission and superior homogenization performance.

5. Performance Testing

We apply stricter-than-standard testing conditions to push the limits of diode packaging. This results in narrower FWHM (Full Width at Half Maximum) and higher power output.